BGA Chip Replcement

A ball grid array (BGA) – printed circuit board (PCB) assembly or repair. BGAs unique nature  designed to permanently mate the PCB and its attendant integrated circuit and getting to the connecting pins — or heating the entire device to the heating point of the solder, possibly ruining it — is almost impossible.

BGA Chip Replacement is better solution than Re-balling. Of course re-balling   is a particularly cost-effective solution, which is not long lasting decision. Instead of  replace the entire system better is to be replace the chip with a new one.

We suggest  solutions for all your circuit board and motherboard BGA rework and repair needs. We’re equipped with top-of-the line Metcal BGA rework system and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework.

We offer a wide variety of services including BGA component removal, replacement and salvage; under microscope inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites.

BGA Chip Replacement with the new one.